Dow DOWSIL™ 1-4173

SKU: 0002-01-000166|xnx

Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental contaminants.




Additional information

Weight 0.081 kg
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