New to the Ellsworth Adhesives portfolio, Dow DOWSIL TC-5150 thermally conductive gap filler is designed to protect and enhance electronic components.
DOWSIL TC-5150 is a one-part non-curable gap filler with 5 W/mK thermal conductivity. The high-performance product has been developed to dissipate heat from electronics to a heat sink, providing a reliable cooling solution for a variety of applications. This thereby provides protection to the electronic device as well as increasing the operations efficiency.
Like other Dow thermally conductive products, TC-5150 is made with silicone materials heavily filled with heat conductive metal oxides. This combination provides high thermal conductivity and high temperature stability. Additionally, the product eliminates mixing and curing requirements for increased productivity and reduced energy consumption. It also allows re-work to be performed in the component.
DOWSIL TC-5150 has excellent balanced properties of dispensability, low volatile content, and vertical hold stability. These properties make the versatile gap-filler suitable for a host of thermal management applications.
- Automotive electronic control units
- Processors and microprocessors
- Power electronics
- Telecom base stations
- Power supplies and semiconductors
- Memory and power modules
- Central processing units (CPUs)
- On board chargers