Additional information
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Dow DOWSIL™ TC-2035 Thermally Conductive Adhesive is a two component, silicone heat curing adhesive with primerless adhesion and low bond line thickness. It offers outstanding dielectric properties, stable performance at high temperatures, and bonds to a variety of substrates.
Size: 3.2kg KIT Normally ships within: Sold in quantity of:Manufacturer part no. | |
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