Dow DOWSIL™ 3-4170 Dielectric Gel is a two-component, soft 1:1 mix ratio gel that is used for potting and protecting PCB system assemblies. 362.8kg
Key Features Dow DOWSIL™ 3-4170:
Clear
Fast heat cure
Long working time
Low viscosity aid process flexibility
Impregnation may be successful without vacuum
Fast heat cure for increased processing speeds
Long working time at RT and low viscosity provide processing flexibility
Size: 362.8kg
Normally ships within: Sold in quantity of:
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