Additional information
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Dow DOWSIL™ Q1-9226 Adhesive – part A / part B – 210ml KIT
Dow DOWSIL™ Q1-9226 Adhesive is a two-component, semi-flowable thermally conductive adhesive that can bond organic and ceramic substrates that can heat skins for control modules in automotive applications. Dow DOWSIL™ Q1-9226 Adhesive is a two-part, semi-flowable thermally conductive adhesive that is used for bonding organise and ceramic substrates. It is typically used for bonding substrates to heat sinks for control modules in automotive applications. 210 ml KIT Key Features of Dow DOWSIL™ Q1-9226 Adhesive:
- Mix ratio: 1 to 1
- Accelerated heat cure
- Self-priming adhesion too many substrates
- Long pot life for ease of use
