Dymax 9309-SC Reinforcement Adhesive – 300g Cartridge

Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The material provides rapid bonding to leadframe, PCB, silicon, and ceramic.

The product is ideal for reinforcement of fine-pitch leads or leadless components on printed circuit boards as well as an alternative to underfill. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispensing. 300g Cartridge.

Features & Benefits:

• Edgebond/CSP reinforcement adhesive
• Cures with UV/Visible light
• See Cure - dispenses blue, cures clear
• Compatible with needle or jet dispensing equipment
• Highly thixotropic for minimal movement after dispense
• Reduces stress on board components
• No solvents added