Dymax 9008 UV Curing Encapsulant – 10g Syringe

Dymax 9008 is engineered for chip encapsulation on flex circuits. The product cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications.

Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton), DAP, glass, epoxy board, metal, and PET. 10g Syringe.

Features & Benefits:

• UV Curable flex circuit adhesive and encapsulant
• Cures with UV/Visible light
• Remains flexible at low temperatures (to -40C°)
• Low dielectric constant for high frequency applications
• Highly moisture resistant
• Low VOC