Dymax 9103 Dual-Cure Encapsulant – 30g Syringe

Dymax Dual-Cure 9103 encapsulant is a resilient light/moisture-cure chip-encapsulating material. 9103 cures first upon exposure to UV/Visible light, then with ambient moisture over time for areas on PCBs where shadow areas are present.

The product is suitable for bonding substrates such as FR4, glass, and also Kapton. Typical encapsulating applications include chip-on-board, flex, and glass, as well as wire bonding. 30g Syringe.

Features & Benefits:

• Light/moisture curing clear encapsulant
• Cures with UV/Visible light
• Dual Cure - secondary moisture cure capability
• Shadowed area performance
• Flexible encapsulant
• Low VOC