Dymax 9309-SC Adhesive – 30g Syringe

Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedise circuit board components. This edge bond material is ideal for applications where shock attenuation or ruggedization is necessary. 9309-SC is formulated with See-Cure colour change technology, meaning that the colour changes from blue to colourless when exposed to sufficient light energy.

The product is ideal for reinforcement of fine pitch leads or leadless components on printed circuit boards as well as an alternative to underfill. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimising movement after dispensing. 30g Syringe.

Features & Benefits:

• Edgebond/CSP reinforcement adhesive
• Cures with UV/Visible light
• See Cure – Dispenses blue, cures clear
• Highly thixotropic for minimal movement after dispense
• Adheres to various PCB substrates
• Reduces stress on board components
• Compatible with needle or jet dispensing equipment