Loctite ECCOBOND FP4531 – 30cc

Loctite ECCOBOND FP4531 is an epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1mm. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications.

Loctite ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C and passes NASA outgassing standards.

Please note, this product is frozen and must be shipped in dry ice. Contact us for more information.

Features & Benefits:

• Black
• Snap curable
• Fast flow
• Passes NASA outgassing
• Increasing reliability of a small-gap flip-chip
• Heat cure