Additional information
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Loctite ECCOBOND UF1173
Loctite ECCOBOND UF1173 is a one component, black liquid, epoxy underfill created for high reliability electronic applications. It provides interconnect protection from shock, drop and vibration.
ECCOBOND UF1173 is designed to provide a uniform and void-free encapsulating underfill which maximises a device's temperature cycling capability and dissipates stress away from solder joints and connections.
Features & Benefits:
- One component
- Void-free underfill
- Can be needle or jet dispensed
- Long pot life
- Low CTE
- Heat cure
- Available in 10cc or 55cc
