MicroCare BGA Aqueous Stencil Cleaner – 340g Spray

MicroCare BGA Aqueous Stencil Cleaner is designed for use on circuit board assembly lines to clean stencils, frames, boards and other stencil-printing equipment. The cleaner quickly removes lead-free and no-clean solder pastes, uncured chip bonders and ink.

Aqueous stencil cleaner loosens paste from the smallest apertures, and minimises the risk of damage to stencils from scrubbing with weaker cleaners. 340g spray.

Features & Benefits:

• Aqueous stencil cleaner to remove all type of raw solder pastes, uncured chip bonder and inks
• Use on stencils, webbing, frames and misprinted boards
• Fast cleaning, even inside small stencil apertures
• Nonflammable and noncorrosive
• Slow drying for longer cleaning time