Silicone adhesives and conformal coatings are known for forming robust bonds which exhibit high levels of flexibility, as well as excellent chemical and heat resistance. Whilst these characteristics are a huge advantage in bonding applications, they can make the process of removing silicones from surfaces or equipment a difficult task. We’ve highlighted 5 key adhesive…

Ellsworth Adhesives are now taking orders for the newly-launched Dow (formerly Dow Corning) Dowsil™ EI-2888 Primerless Silicone Encapsulant. Dowsil™ EI-2888 is an optically clear encapsulant designed for professional LED lighting applications. The 100 percent silicone encapsulant provides LEDs with essential protection from moisture and surface contaminants. Dow’s Dowsil™ EI-2888 has unique optimum rheological properties which…

Acrylic adhesives are part of the structural adhesive family, making them a great multi-purpose and versatile bonding choice. They can bond a wide range of substrates and are available in two-part catalyst cure or one-part UV and heat cure formulations. Read on to find out 6 common uses of acrylic adhesives and the reasons why…

The new Metcal CV-510 Connection Validation Soldering System, companion station to the manufacturer’s popular CV-510 Soldering system, is now available to order from Ellsworth Adhesives. The Metcal CV-510 packs all the unique features of Connection Validation (CV) technology into a compact and economical housing. Connection Validation is a patented technology which can evaluate the quality…

Instant adhesives, otherwise known as cyanoacrylates or “super glues” are the most commonly used adhesive in the industry. Instant adhesives are considered to be general purpose as they suit a wide range of diverse applications and adhere to a host of different substrates. This adhesive type cures when exposed to the moisture in the air,…

  The newly launched Henkel Loctite ECCOBOND UF 1173 is now available to order from Ellsworth Adhesives Europe, adding to our extensive range of specialty chemicals. This one component, epoxy underfill has been created for the next-generation of high reliability electronics applications. It is designed to provide a uniform and void-free encapsulating underfill, which maximises…