Robnor ResinLab PX900D is a low viscosity, unfilled epoxy resin system designed for use in the electronics industry, for applications requiring high levels of insulation resistance, chemical resistance and elevated temperature use. Capable of room temperature curing, the resin exhibits relatively high heat distortion temperatures.
Low viscosity
Long pot life
Excellent insulation characteristics
Excellent long-term heat resistance
Excellent chemical resistance
Size: 250g Twinpack
Normally ships within: Sold in quantity of:
Request A Quote For PX900D Epoxy Composite – 250g Twinpack, Natural