Dow DOWSIL™ 1-4174

SKU: 0002-01-000168|xnx

Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, high tensile strength, and a controlled bond line thickness.




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Weight 1.5 kg
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